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9
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vol 63 / September, 2020
Article

DOI 10.17586/0021-3454-2015-58-7-571-575

UDC 536.2

INVESTIGATION OF THERMAL CONDUCTIVITY OF SILICONE BASED COMPOSITE MATERIALS WITH FILLERS

V. A. Mikheev
BSTU “VOENMEH”; Graduate Student


V. S. Sulaberidze
BSTU “VOENMEH”;


V. D. Mushenko
STOLP Ltd.; General Director


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Reference for citation: Mikheev V. A., Sulaberidze V. Sh., Mushenko V. D. Investigation of thermal conductivity of silicone based composite materials with fillers // Izvestiya Vysshikh Uchebnykh Zavedeniy. Priborostroenie. 2015. Vol. 58, N 7. P. 571—575 (in Russian).

Abstract. Specifics of theoretical evaluation of thermal conductivity of the composite material are considered, the effect of dispersed filling phase is analyzed. The method of design of a formula for the composite thermal conductivity by inversion of the filler and the binder is shown to be efficient.
Keywords: thermal conductivity, composite materials, compound, filler, binder, silicon dioxide, aluminium nitride