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9
Issue
vol 63 / September, 2020
Article

DOI 10.17586/0021-3454-2015-58-7-576-580

UDC 621.396.6

PLACEMENT OPTIMIZATION OF PRINTED CIRCUIT BOARDS IN THERMAL DESIGN OF HERMETICALLY SEALED UNIT

V. N. Krishchuk
Zaporizhian National Technical University; Professor


G. N. Shilo
Zaporizhian National Technical University; Associate


Y. A. Lopatka
Zaporizhian National Technical University; Post-Graduate Student


N. P. Gaponenko
Zaporizhian National Technical University; Associate Professor


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Reference for citation: Krishchuk V. N., Shilo G. N., Lopatka Yu. A., Gaponenko N. P. Placement optimization of printed circuit boards in thermal design of hermetically sealed unit // Izvestiya Vysshikh Uchebnykh Zavedeniy. Priborostroenie. 2015. Vol. 58, N 7. P. 576—580 (in Russian).

Abstract. The influence of placing of printed circuit boards on thermal conditions of stack package is considered. Peculiarities of heat removal in hermetically sealed unit are described. A method for optimizing the boards placing with due regard for differences between heat power dissipated by separate functional units is developed with the use of a CAE system for simulation of thermal conditions.
Keywords: thermal design, placing printed circuit boards, hermetically sealed unit, optimization, software