ISSN 0021-3454 (print version)
ISSN 2500-0381 (online version)
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8
Issue
vol 63 / August, 2020
Article

DOI 10.17586/0021-3454-2018-61-4-368-373

UDC 621.3.084.2

MINIMIZATION OF MECHANICAL STRESSES IN SENSITIVE ELEMENT OF MICRO-PRESSURE SENSOR UNDER PACKAGING

E. I. Volkova
Yu. Ye. Sedakov Research Institute of Measuring Systems, Department of Research and Development of Analog and Digital-Analog Integrated Circuits; ; Research Engineer


S. A. Popkov
Yu. Ye. Sedakov Research Institute of Measuring Systems, Department of Research and Development of Analog and Digital-Analog Integrated Circuits; Senior Scientist


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Abstract. Results of studies of mechanical stresses that occur in the sensitive element of micro-pressure sensor when it is mounted in the package are presented. The finite element method is used to numerically simulate both the residual mechanical stresses of the sensitive element crystal and the stresses caused by thermal expansion-compression, when the sensitive element crystal is placed in the system which binds support crystal and package. The optimal design of support crystal, which includes both two-dimensional and three-dimensional temperature compensator elements, is found to allow for minimizing stresses caused by temperature fluctuations. Among the considered types of support crystals, the ones that do not add additional negative functional in the output characteristic during sensitive element operation are selected, and a design that is easy to manufacture is chosen. An appropriate model of support crystal that is applicable for sensitive element sensor of both the absolute and differential pressure is proposed. 
Keywords: support chip, mechanical stresses, sensitive element, pressure microsensor, microsystem technology

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