APPLICATION OF VIRTUAL SIMULATION SYSTEMS TO DEVELOPMENT OF HOUSING PROCESSES FOR ELECTRONIC COMPONENTS
ITMO University; Department Head
P. V. Smirnov
ITMO University, Department of Instrumentation Technology, St. Petersburg; Post-Graduate Student
A. . Vorobyev
Saint Petersburg National Research University of Information Technologies, Mechanics and Optics; student
Read the full article
Abstract. Main types of housing for integrated circuits and housing technology based on injection-compression molding are considered. Advantages of polymer materials application for electronic component housing are demonstrated. Peculiarities of employment of virtual systems of technological processes simulation in manufacturing of various types of housing are analyzed.
Keywords:
housing, electronic component, injection-compression molding, engineering analysis, specialized software package, simulation of technological process
