ISSN 0021-3454 (print version)
ISSN 2500-0381 (online version)
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2
Issue
vol 60 / FEBRUARY, 2017
Article
UDC 621.363

APPLICATION OF VIRTUAL SIMULATION SYSTEMS TO DEVELOPMENT OF HOUSING PROCESSES FOR ELECTRONIC COMPONENTS

Y. I. Yablochnikov
ITMO University; Department Head


P. V. Smirnov
ITMO University, Department of Instrumentation Technology, St. Petersburg; Post-Graduate Student


A. . Vorobyev
Saint Petersburg National Research University of Information Technologies, Mechanics and Optics; student


Abstract. Main types of housing for integrated circuits and housing technology based on injection-compression molding are considered. Advantages of polymer materials application for electronic component housing are demonstrated. Peculiarities of employment of virtual systems of technological processes simulation in manufacturing of various types of housing are analyzed.
Keywords: housing, electronic component, injection-compression molding, engineering analysis, specialized software package, simulation of technological process