DOI 10.17586/0021-3454-2015-58-7-571-575
UDC 536.2
INVESTIGATION OF THERMAL CONDUCTIVITY OF SILICONE BASED COMPOSITE MATERIALS WITH FILLERS
BSTU “VOENMEH”; Graduate Student
V. S. Sulaberidze
BSTU “VOENMEH”;
V. D. Mushenko
STOLP Ltd.; General Director
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Reference for citation: Mikheev V. A., Sulaberidze V. Sh., Mushenko V. D. Investigation of thermal conductivity of silicone based composite materials with fillers // Izvestiya Vysshikh Uchebnykh Zavedeniy. Priborostroenie. 2015. Vol. 58, N 7. P. 571—575 (in Russian).
Abstract. Specifics of theoretical evaluation of thermal conductivity of the composite material are considered, the effect of dispersed filling phase is analyzed. The method of design of a formula for the composite thermal conductivity by inversion of the filler and the binder is shown to be efficient.
Abstract. Specifics of theoretical evaluation of thermal conductivity of the composite material are considered, the effect of dispersed filling phase is analyzed. The method of design of a formula for the composite thermal conductivity by inversion of the filler and the binder is shown to be efficient.
Keywords: thermal conductivity, composite materials, compound, filler, binder, silicon dioxide, aluminium nitride
