DOI 10.17586/0021-3454-2015-58-7-576-580
UDC 621.396.6
PLACEMENT OPTIMIZATION OF PRINTED CIRCUIT BOARDS IN THERMAL DESIGN OF HERMETICALLY SEALED UNIT
Zaporizhian National Technical University; Professor
G. N. Shilo
Zaporizhian National Technical University; Associate
Y. A. Lopatka
Zaporizhian National Technical University; Post-Graduate Student
N. P. Gaponenko
Zaporizhian National Technical University; Associate Professor
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Reference for citation: Krishchuk V. N., Shilo G. N., Lopatka Yu. A., Gaponenko N. P. Placement optimization of printed circuit boards in thermal design of hermetically sealed unit // Izvestiya Vysshikh Uchebnykh Zavedeniy. Priborostroenie. 2015. Vol. 58, N 7. P. 576—580 (in Russian).
Abstract. The influence of placing of printed circuit boards on thermal conditions of stack package is considered. Peculiarities of heat removal in hermetically sealed unit are described. A method for optimizing the boards placing with due regard for differences between heat power dissipated by separate functional units is developed with the use of a CAE system for simulation of thermal conditions.
Abstract. The influence of placing of printed circuit boards on thermal conditions of stack package is considered. Peculiarities of heat removal in hermetically sealed unit are described. A method for optimizing the boards placing with due regard for differences between heat power dissipated by separate functional units is developed with the use of a CAE system for simulation of thermal conditions.
Keywords: thermal design, placing printed circuit boards, hermetically sealed unit, optimization, software
