Abstract. The effect of printed conductors tracing on the thermal modes of printed components of radio-electronic devices is investigated. It is shown that the failure to take into account the thermal process in copper printed conductors when assessing the thermal regime of boards at the development stage can lead to large errors in assessing the radio-electronic device reliability. For computer simulation of thermal regimes, the widely used computer-aided design system SolidWorks is used. Comparison of the results of modeling the printed circuit assembly of the rangefinder with the experimental data makes it possible to prove the need to take into account thermal processes in printed conductors when simulating the radio-electronic devices. It is demonstrated that the commonly used thermal models of printed circuit assemblies, which do not take into account metallization, may lead to an error in determining the temperature of electronic elements up to 22 %. This does not make it possible to make a correct decision on ensuring the reliability of the radio-electronic devices.

Keywords: electronic devices, printed circuit assembly, tracing, metallization, thermal processes, heat removal, reliability assurance

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